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Toshiba readies 128GB memory module for mobile devices

Toshiba readies 128GB memory module for mobile devices

Toshiba America Electronic Components announced plans to ship a 128GB embedded NAND flash memory module, the highest capacity available for smartphones, tablet PCs, and digital video cameras.

The module has a 46MBps read speed and a 21MBps write speed.

The new NAND flash memory module will be available in samples for mobile equipment manufacturers in September, with mass production starting in the fourth quarter of the year. New samples of chips with 64GB capacity will be available in August.

The module stacks 16 64Gb NAND chips fabricated using a 32-nanometer (nm) lithography process, which allowed Toshiba to fit it and a dedicated controller into a small package, 0.66-inch wide by 0.86-inch long, and only .05-in thick. The individual NAND chips are only 30 micrometers thick. A micrometer is equal to one-millionth of a meter.

Read More/Source: Infoworld

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