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  • Supports Intel XMP (Extreme Memory Profiles) version 1.3
  • Supports dual channel mode
  • RoHS compliant
  • Complies with JEDEC standards.
  • Uses high-quality 8-layer printed circuit boards and aluminum heat sink, effectively reducing the memory module temperature
  • Adopts Thermal Conductive Technology (TCT) thermal technology for heat dispersal
  • Supports Intel Core processors and the latest fourth-generation Z87 platform

  • Model: XPG V2 DDR3 3100
  • Stratified Random Assignment Timing: DDR3 1333 CL9-9-9-24 at 1.5V & DDR3 3100 CL12-14-14-36 at 1.65V (XMP Profile 1)
  • Density: 8GB (4GB x 2)
  • Essay Writing Learning Frequency (Peak transfer rate): 3100MHz (24,800MB/sec)
  • Voltage: 1.65 Volts

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