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Thursday | January 19, 2017
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  • Supports Intel XMP (Extreme Memory Profiles) version 1.3
  • Supports dual channel mode
  • RoHS compliant
  • Complies with JEDEC standards.
  • Uses high-quality 8-layer printed circuit boards and aluminum heat sink, effectively reducing the memory module temperature
  • Adopts Thermal Conductive Technology (TCT) thermal technology for heat dispersal
  • Supports Intel Core processors and the latest fourth-generation Z87 platform

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