Samsung Announces 3D Chip Packaging Technology

Vikingod · Apr 14, 2006, 02:21 PM

Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging. The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology "wafer-level stack process" or WSP.
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Read More / Source: DailyTech

Apr 14, 2006, 02:21 PM	#1
Vikingod Int'l Fish Liaison Join Date: Jul 2004 Location: By the light of lamp I sit and type... Posts: 16,197 Rep Power: 112 System Specs	Samsung Announces 3D Chip Packaging Technology Samsung just announced a new method to pack more memory into small spaces -- three-dimensional chip packaging. The technique works by adding "through silicon" interconnects on the memory module and then daisy chaining multiple modules through the interconnects. Samsung has dubbed this new technology "wafer-level stack process" or WSP. __________ Read More / Source: DailyTech