Samsung develops new chip-stacking solution

Vikingod · Nov 1, 2006, 12:07 PM

Source: The Tech Report
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The R&D folks at Samsung have come up with what they claim is the industry's first process that allows 16 memory chips to be stacked on a single package. To achieve this feat, Samsung used some new wafer thinning and chip sawing techniques:
For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (μm). This is just 65 percent the thickness of the 10-chip MCP wafer (45μm) Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.

Nov 1, 2006, 12:07 PM	#1
Vikingod Int'l Fish Liaison Join Date: Jul 2004 Location: By the light of lamp I sit and type... Posts: 16,197 Rep Power: 112 System Specs	Samsung develops new chip-stacking solution Source: The Tech Report __________ The R&D folks at Samsung have come up with what they claim is the industry's first process that allows 16 memory chips to be stacked on a single package. To achieve this feat, Samsung used some new wafer thinning and chip sawing techniques: For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated wafer to reduce the overall thickness to only 30-microns (μm). This is just 65 percent the thickness of the 10-chip MCP wafer (45μm) Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30 microns.