AMD Puts Customer at Center of Chip Manufacturing in ISMI Opening Keynote Address

Vikingod · Oct 26, 2007, 01:38 AM

Source: AMD
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AMD will present the morning keynote at the 4th International SEMATECH Manufacturing Initiative (ISMI) Symposium emphasizing the need for a smarter, industry-wide approach to semiconductor development, production and delivery that better meets customer needs.

Dr. Douglas Grose, senior vice president of manufacturing, technology development and supply chain at AMD, will describe what he and a growing list of industry leaders see as strategic imperatives for the Next Generation Factory (NGF). “The industry can adopt a vision here today to better meet customers’ needs with accuracy, agility and efficiency, in addition to the more traditional route of making wafers larger and transistors smaller,” said Grose.

Dr. Grose’s speech extends an ongoing NGF dialogue with integrated circuit manufacturers, material suppliers, tool vendors and industry analysts on how to maximize utilization of existing 300mm technologies and facilities before moving onto a larger, 450mm wafer size.

Oct 26, 2007, 01:38 AM	#1
Vikingod Int'l Fish Liaison Join Date: Jul 2004 Location: By the light of lamp I sit and type... Posts: 16,197 Rep Power: 112 System Specs	AMD Puts Customer at Center of Chip Manufacturing in ISMI Opening Keynote Address Source: AMD ______________ AMD will present the morning keynote at the 4th International SEMATECH Manufacturing Initiative (ISMI) Symposium emphasizing the need for a smarter, industry-wide approach to semiconductor development, production and delivery that better meets customer needs. Dr. Douglas Grose, senior vice president of manufacturing, technology development and supply chain at AMD, will describe what he and a growing list of industry leaders see as strategic imperatives for the Next Generation Factory (NGF). “The industry can adopt a vision here today to better meet customers’ needs with accuracy, agility and efficiency, in addition to the more traditional route of making wafers larger and transistors smaller,” said Grose. Dr. Grose’s speech extends an ongoing NGF dialogue with integrated circuit manufacturers, material suppliers, tool vendors and industry analysts on how to maximize utilization of existing 300mm technologies and facilities before moving onto a larger, 450mm wafer size.