Intel to begin chip production on 450 mm wafers in 2012

CDsDontBurn · May 6, 2008, 10:52 AM

Intel today said that it has reached an agreement with Samsung and TSMC to enable a 450 mm wafer-based chip production by 2012. Like the transition to 300 mm, which Intel introduced with its 130 nm processor generation in 2001, 450 mm wafers will help the semiconductor industry to scale the economics of chip manufacturing. Intel is expected to use the technology first for its 22 nm products, which are expected to debut in late 2011.

Source: TG Daily

**kris23** · May 6, 2008, 03:10 PM

so twice the surface area?

May 6, 2008, 10:52 AM	#1
CDsDontBurn 127.0.0.1 Join Date: May 2003 Location: Southern California Posts: 22,458 Rep Power: 202 System Specs	Intel to begin chip production on 450 mm wafers in 2012 Intel today said that it has reached an agreement with Samsung and TSMC to enable a 450 mm wafer-based chip production by 2012. Like the transition to 300 mm, which Intel introduced with its 130 nm processor generation in 2001, 450 mm wafers will help the semiconductor industry to scale the economics of chip manufacturing. Intel is expected to use the technology first for its 22 nm products, which are expected to debut in late 2011. Source: TG Daily __________________ Her First Day \| A year later

May 6, 2008, 03:10 PM	#2
kris23 Going Insane..... Join Date: Dec 2006 Location: Los Angeles Posts: 5,990 Rep Power: 121 System Specs	so twice the surface area? __________________ Hardwareheaven Super-Moderator Building a new computer system and not sure where to start? Click Here! last updated (5/18/11) Rosewill FUTURE case replaces CM 690 II with its greater interior length. Building a PC: Step by Step Guide Written by Kristopher Pedemonte and Nathan Marks-Forder Edited by Allan Campbell Questions or Comments? feel free to post them in the forums!