"A well-known maker of quality memory modules – OCZ Technology Group – today discussed its new technique to address interference and noise issues on high-speed memory modules. The tech is expected to be available on OCZ’s future products, including upcoming DDR-II memory modules.
Based upon the success of Ultra Low Noise PCBs used in all OCZ’s memory sticks for overclockers, OCZ Technology has improved upon the quality and design of the PCB and is now ready to begin using PCBs based on ULN 2 Technology to further reduce noise and interference on the PCB."
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