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Corsair has advertised their new 2 GB TWINX2048-3500LLPRO matched memory kit, as specifically designed for motherboards using chipset's with dual memory channels (AMD Athlon 64 platform). This memory kit consists of two CMX1024-3500LLPRO memory modules, that have been tested together on a current production AMD motherboard at DDR437 (218 MHz). This memory sports extremely low latencies of 2-3-2-6 (CAS-TRCD-TRP-TRAS), utilizing a Command Rate of 1. These TwinX memory kits are designed to provide the ultimate in performance and stability in dual channel boards. As an added benefit of Corsair's XMS ProSeries, each module includes the high-efficiency aluminum XMS heatsink, and 18 activity LED's that show the level of memory activity on each bank.

In a quote from a joint press release dated September 26th, heralding a partnership which Corsair struck with ASUSTek - they announced the performance levels of the ASUS-ready A8N32-SLI Deluxe/WiFi motherboards in conjunction with the Corsair XMS-3500LL PRO 2GB paired memory modules.

"Corsair® Memory, Inc., a worldwide leader in high performance memory and cooling products for enthusiasts and overclockers, and ASUSTek®, the perennial leader of the motherboard industry, today announced a joint product launch targeting the AMD® enthusiasts. Under this collaboration, Corsair will release its first ASUS Ready XMS-3500LL PRO 2GByte-kit to support the release of the first Corsair optimized x16 SLI motherboards engineered by ASUS. Available in a matched pair of two 1GByte modules, the new XMS-3500LL PRO is the industry's first high-density memory guaranteed to deliver blazing-fast performance of DDR437 (218MHz) at low latencies of 2-3-2-6-1T."

Let's take a closer look at the product packaging and the DIMM's in the pictures below:

Now that we've taken a look at the "beauty" shots of this new memory by Corsair, let's examine what is underneath those stylish black aluminum heat spreaders. On Corsair's product information page, they state these heat spreaders provide a 95% greater surface area than standard memory heat spreaders, and one Corsair innovation they continued on these modules, was the thermal bonding accomplished with the heat spreaders, to the memory modules themselves.

Lurking underneath the classy but effective heat spreaders, lie Infineon -5 64M X 8 Revision B IC's that have been speed binned by Corsair for use in this product. This is BE-5, or 5 nanosecond RAM, with normal timings of 2-3-3-6. Corsair has shipped these modules with the SPD programmed at 2-3-2-6 at a 1T Command Rate as previously mentioned. In previous iterations of Corsair's 3500LL Rev 1.1 memory, the IC's used were Winbond -5 Rev C, however to due short supply Corsair moved to Infineon IC's which proved quite apt for use in their low latency memory modules.

Infineon claims that their DRAM trench technology - using their cell concept, requires significantly lower array voltage to store electrical charges, compared to stack technologies. The benefit of reduced power consumption is reduced heat dissipation. On Infineon's DDR SDRAM components page they show the Infineon -5 Revision B IC's with normal operation (-5) for DDR400 at 3-3-3 timings. Please note as mentioned before, that Corsair has programmed their SPD timings at an advanced 2-3-2-6 1T, allowing the enthusiast to enjoy the advantages of lower latencies.


*2048 Megabytes of memory
(Two CMX1024-3500LLPRO memory DIMMs)

*High-efficiency aluminum XMS heatsink
(95% greater surface area than standard memory heatspreaders)
(Thermally bonded to the module)

*18 activity LED's show level of memory activity

*Benchmarked over multiple chip sets,processors, and motherboards

*Approximately 1.75" tall x 5.41" long x 0.30" wide; 2.9 oz

*Lifetime warranty


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