Corsair has advertised their new 2 GB
TWINX2048-3500LLPRO matched memory kit, as specifically
designed for motherboards using chipset's with dual memory
channels (AMD Athlon 64 platform). This memory kit consists
of two CMX1024-3500LLPRO memory modules, that have been
tested together on a current production AMD motherboard
at DDR437 (218 MHz). This memory sports extremely low
latencies of 2-3-2-6 (CAS-TRCD-TRP-TRAS), utilizing a
Command Rate of 1. These TwinX memory kits are designed
to provide the ultimate in performance and stability in
dual channel boards. As an added benefit of Corsair's
XMS ProSeries, each module includes the high-efficiency
aluminum XMS heatsink, and 18 activity LED's that show
the level of memory activity on each bank.
In a quote from a joint
press release dated September 26th, heralding
a partnership which Corsair struck with ASUSTek - they
announced the performance levels of the ASUS-ready A8N32-SLI
Deluxe/WiFi motherboards in conjunction with the Corsair
XMS-3500LL PRO 2GB paired memory modules.
"Corsair® Memory, Inc.,
a worldwide leader in high performance memory and cooling
products for enthusiasts and overclockers, and ASUSTek®,
the perennial leader of the motherboard industry, today
announced a joint product launch targeting the AMD®
enthusiasts. Under this collaboration, Corsair will release
its first ASUS Ready XMS-3500LL PRO 2GByte-kit to support
the release of the first Corsair optimized x16 SLI motherboards
engineered by ASUS. Available in a matched pair of two
1GByte modules, the new XMS-3500LL PRO is the industry's
first high-density memory guaranteed to deliver blazing-fast
performance of DDR437 (218MHz) at low latencies of 2-3-2-6-1T."

Let's take a closer look at the product
packaging and the DIMM's in the pictures below:
Now that we've taken a look at the
"beauty" shots of this new memory by Corsair,
let's examine what is underneath those stylish black
aluminum heat spreaders. On Corsair's
product information page, they state these
heat spreaders provide a 95% greater surface area than
standard memory heat spreaders, and one Corsair innovation
they continued on these modules, was the thermal bonding
accomplished with the heat spreaders, to the memory
modules themselves.
Lurking underneath the classy but effective
heat spreaders, lie Infineon -5 64M X 8 Revision B IC's
that have been speed binned by Corsair for use in this
product. This is BE-5, or 5 nanosecond RAM, with normal
timings of 2-3-3-6. Corsair has shipped these modules
with the SPD programmed at 2-3-2-6 at a 1T Command Rate
as previously mentioned. In previous iterations of Corsair's
3500LL Rev 1.1 memory, the IC's used were Winbond -5
Rev C, however to due short supply Corsair moved to
Infineon IC's which proved quite apt for use in their
low latency memory modules.
Infineon claims that their DRAM trench
technology - using their cell concept, requires significantly
lower array voltage to store electrical charges, compared
to stack technologies. The benefit of reduced power consumption
is reduced heat dissipation. On Infineon's DDR SDRAM components
page they show the Infineon -5 Revision B IC's with normal
operation (-5) for DDR400 at 3-3-3 timings. Please note
as mentioned before, that Corsair has programmed their
SPD timings at an advanced 2-3-2-6 1T, allowing the enthusiast
to enjoy the advantages of lower latencies.
Features
*2048 Megabytes of memory
(Two CMX1024-3500LLPRO memory DIMMs)
*High-efficiency aluminum XMS heatsink
(95% greater surface area than standard memory heatspreaders)
(Thermally bonded to the module)
*18 activity LED's show level of memory activity
*Benchmarked over multiple chip sets,processors, and motherboards
*Approximately 1.75" tall x 5.41" long x 0.30"
wide; 2.9 oz
*Lifetime warranty