Electronic News:
Korea’s Hynix Semiconductor Inc. has received Intel validation on its 2GByte DDR2-667 small outline, dual in-line memory modules (SODIMMs), the company announced today.
The DRAM supplier manufactures the 2GByte DDR2-667 SODIMMs using its 2Gbit dual die package (DDP) DDR2-667 components. The 2GByte DDP devices, developed by Hynix Package Research Institute, combine two Hynix 1GByte DDR2-667MHz die into a single package.
The Hynix 2GByte DDR2 SODIMMs run at 667MHz and are expected to support future generations of Intel Centrino mobile platforms.
Hynix said the modules increase overall memory performance by 25 percent and double memory capacity.
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