AMD today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions1. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 “Bobcat” CPU cores and a discreet class DirectX® 11-capable GPU on a single die.
“We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement,” said Buddy Broeker, director, Embedded Solutions, AMD. “System designers can now unleash their creativity without being constrained by heat or size issues.”
A fanless solution is crucial for many small embedded systems where the added cost for an active cooling system can be prohibitive or for environments where silent operation is a key requirement. Additionally, many embedded products are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system. The AMD Embedded G-Series platform provides enterprise-class features and performance with the reliability, cost- and power-efficiencies these systems require.
Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.